LPKF ProtoLaser S4, Contac S4 und MultiPress S

A high packing density and the associated high number of circuits or additional PCB tasks require the design of complex prototypes as multilayers. Advantages include shorter track lengths and the number of vias, better grounding and power supply lines, better EMC characteristics and a more compact design.

In a test set-up a double-sided LPKF circuit board, equipped with a 32-bit ARM Cortex microcontroller was reduced to half the size by converting into a 4-layer multilayer. The equipment included LPKF ProtoLaser S4, LPKF Contac S and LPKF MultiPress S. All parts have been placed on one side to avoid two-sided reflow soldering.